Add:No.3178,Renmin Road,Minzhi Street,Longhua District,Shenzhen City,Guangdong Province,China
LED special solder paste is specifically for the LED patch process common problems, the development of a dedicated lead-free solder paste. With high welding ability, solder point bright full, solder point bright, full, even, have climbing characteristics, will not corrode the PCB, the board clean, almost no residue, no erect monument without virtual welding, wettability, not easy to dry, printing the use of a long time, stable effect, more effective to ensure the paste quality.
Good welding performance, solve the LED soft strip patches common in the virtual welding, erected, short circuit problems, reduce the production of poor rate, to a large extent improve the production efficiency and production quality.
Printing pressure: The set value is based on the length and speed of the scraper, should be scraper after the steel plate without residual solder paste, usually using pressure in 200gm/cm2
Printing speed: According to the structure of the circuit board, the thickness of the steel plate and printing capacity.
Hardness: Less than 0.1mm spacing, blade angle of 45 degrees, can use 80~100度 shore hardness of rubber, knives and stainless steel scraper is the most ideal.
Angle: 60 degrees is the standard. Led solder paste Furnace temperature recommended preheating zone, insulation area: to the PBC temperature from ambient ambient temperature to the required active temperature. At the same time in the insulation phase is a low-temperature solder paste full wetting, remove oxides.But the heating slope is too large, the time to reach the flat-topped temperature is too short.One is the thermal impact of the parts is too large The second is to make the solder paste moisture, solvents can not be completely volatile out, to achieve reflux, causing moisture, solvent boiling, splashing tin ball.
Recommendation: 1-3 ℃/sec
Reflow Zone: The compatibility phase is to say that the temperature of the PCB assembly is increased from the active temperature to the recommended peak temperature. Cooling phase: The cooling rate is controlled at 1-4 ℃ per second, thus enabling the formation of small crystals.
Too fast will cause your solder joints to break. Refrigerated storage is stored under the condition of less than 10 ℃ with a shelf life of 6 months. Solder paste should be thawed before use to reach operating temperature, thawing time is 2 hours.